Bonding
BT-VPP-200
The MPT BT-VPP-200 Thermal Bonder is a robust, stable thermal bonding machine built on the hot-jaw principle, like its predecessor, the BT-NG. It is designed to deliver an effective, reliable production solution for bonding all types of balloon and catheter components at minimal cost of ownership.
The most significant upgrade is its movable clamping system. Clamps are positioned on both sides of the hot dies, each offering a 200 mm stroke so the product can be positioned, compressed, tensioned, or side-shifted during bonding. Typical applications include axial compression, axial tension, side shifting, and controlled reflow. Force-controlled die closing delivers repeatable bonding pressure and better process control.
Each die set accommodates up to four cavities, depending on cavity size, with cavity selection controlled through software. Exchange units contain two die sets with independent temperature control, and each cavity can operate at two different temperatures. The maximum cavity size is 12 mm in OD and 16 mm in length.
Force-controlled die closing is paired with integrated, recipe-controlled height adjustment. Recipes store key process settings, including die position, clamp position, die closing force, height position, temperature, bonding time, and camera crosshairs.
Product Details
Key Features
- Movable product clamps on both sides of the dies, each with a 200 mm stroke.
- Supports axial compression, axial tension, side shifting, reflow, and other advanced bonding processes.
- Force-controlled die closing for repeatable bonding pressure and improved process control.
- Recipe editor with drag and drop. Chain bond, cool, clamp move and delay steps, and run clamp moves in parallel with bonding or cooling.
- Recipe-controlled height adjustment and stepper-controlled die positioning for fast, repeatable setup.
- BT-VPP exchange units with programmable intermediate die positions. Compatible with standard BT-NG exchange units.
- Quick exchange die unit for fast product changeover.
- Robust industrial design for reliable production and low cost of ownership.
Available Options
- Safety cover: Shields the bonding area during the process.
- Cognex vision camera for product part detection and/or alignment.
- Communication with customer systems, e.g. SCADA software.
- Product support gutter: Supports long products on either side of the machine. Easy to attach and detach.
- Foot switch.
- Different HMI sizes.
Specs
Die System: Two split die sets on a quick exchange unit
Maximum Temperature: 285 °C (optional higher temperatures possible)
Number Of Cavities: Up to 4 cavities per die set, depending on cavity size
Temperature Zones: 2 temperature zones
Product Handling: Product held by movable clamps on both sides of the die area. Each clamp has a 200 mm stroke.
Product Alignment: Optical alignment with color video camera and up to 20 software crosshairs, horizontal and vertical
Die Closing: Force-controlled die closing, recipe controlled
Air Cooling: Air cooling to allow for fast cooling of the bonded product, with cooling time and air flow set per recipe step
Recipe Editor: Steps are placed by drag and drop. Bond, cool, clamp move, delay and reclamp steps run in series. Clamp moves run in parallel with a bonding or cooling step, position or force controlled, with set speed, acceleration and start delay. Several bonding steps per recipe, each with its own cavity, temperature and time.
Height Adjustment: Integrated recipe-controlled height adjustment
Axial Compression/Tension: Integrated through the movable clamp system
GUI: 13”, 15.4” or 19” color touch panel
Control Software: Recipe-based control software with storage of process parameters, including temperature, bonding time, cavity selection, clamp position, height position, die closing force, and camera crosshairs. User access level system with password-protected operator, engineer, and calibrator roles. Remote support option available.
Required Air Pressure: 7 bar minimum
Power Supply: 115 / 240VAC / 0.5kW
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